The rugged mold carrier system has been designed for accommodating large and heavy encapsulation molds. Its special kinematics results in good ergonomics and the compact size of the mold carrier, even when it is opened.
Free access at the rear and at the front facilitates the integration of feeding and withdrawal systems for inserts, components and molds. For many years, series G mold carrier systems have proven their worth, in particular for the encapsulation of large-scale automotive glass components, such as windscreens and rear windows, as well as for the encapsulation of photovoltaics and solar thermal energy modules with a polyurethane frame.
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|Mold carrier system||BFT-G 17×13||BFT-G 20×14|
|carrier clamping plate (FAP) width||1700 mm||2000 mm|
|carrier clamping plate (FAP) depth||1300 mm||1400 mm|
|parallel stroke||420 mm||420 mm|
|tilting upper FAP||37°||37°|
|tilting lower FAP||max. 25°||max. 25°|
|closing force max.||500 kN||500 kN|
|load max. upper FAP||3000 kg||3000 kg|
|load max. lower FAP||4000 kg||4000 kg|
|fitting dimension||780 mm||780 mm|