BFT-G

The rugged mold carrier system has been designed for accommodating large and heavy encapsulation molds. Its special kinematics results in good ergonomics and the compact size of the mold carrier, even when it is opened.

Free access at the rear and at the front facilitates the integration of feeding and withdrawal systems for inserts, components and molds. For many years, series G mold carrier systems have proven their worth, in particular for the encapsulation of large-scale automotive glass components, such as windscreens and rear windows, as well as for the encapsulation of photovoltaics and solar thermal energy modules with a polyurethane frame.

BFT-G mold carrier

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Product data

Mold carrier system BFT-G 17×13 BFT-G 20×14
drive hydraulic hydraulic
carrier clamping plate (FAP) width 1700 mm 2000 mm
carrier clamping plate (FAP) depth 1300 mm 1400 mm
parallel stroke 420 mm 420 mm
tilting upper FAP 37° 37°
tilting lower FAP max. 25° max. 25°
closing force max. 500 kN 500 kN
load max. upper FAP 3000 kg 3000 kg
load max. lower FAP 4000 kg 4000 kg
fitting dimension 780 mm 780 mm