The BFT-K mold-carrier system is ideal for glass finishing on the basis of sophisticated mould technology and a high level of automation.
With its sophisticated mold technology and its high degree of automation, the BFT-K mold carrier system is ideal for glass-finishing applications.
Components can be inserted and removed from two sides, ensuring optimum material flow. For example, the finished component may be removed from the upper part of the mold and carried away toward the front while at the back the lower part of the mold is prepared for the next encapsulation run.
The BFT-K mold-carrier system is also the ideal candidate for any encapsulation applications that feed the foam into the open mold. A shuttle device can be used to guide the lower part of the mold to a convenient position outside the closing unit in order to use a robot to feed the foam.
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Mold carrier system
|BFT-K 16x12||BFT-K 20×11|
|carrier clamping plate (FAP) width||1600 mm||2000 mm|
|carrier clamping plate (FAP) depth||1200 mm||1400 mm|
|parallel stroke||420 mm||520 mm|
|tilting upper FAP||37°||37°|
|tilting lower FAP||---||max 38°|
|closing force max.||500 kN||500 kN|
|load max. upper FAP||3000 kg||3000 kg|
|load max. lower FAP||4000 kg||4000 kg|
|fitting dimension||780 mm||630 mm|