The BFT-K mould-carrier system is ideal for glass finishing on the basis of sophisticated mould technology and a high level of automation.
With its sophisticated mould technology and its high degree of automation, the BFT-K mould carrier system is ideal for glass-finishing applications.
Components can be inserted and removed from two sides, ensuring optimum material flow. For example, the finished component may be removed from the upper part of the mould and carried away toward the front while at the back the lower part of the mould is prepared for the next encapsulation run.
The BFT-K mould-carrier system is also the ideal candidate for any encapsulation applications that feed the foam into the open mould. A shuttle device can be used to guide the lower part of the mould to a convenient position outside the closing unit in order to use a robot to feed the foam.
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|Mould carrier system||BFT-K 20×11|
|mould mounting plate – width||2000 mm|
|mould mounting plate – depth||1400 mm|
|parallel stroke||520 mm|
|tilting angle, upper mould mounting plate||37°|
|tilting angle, lower mould mounting plate||max 38°|
|closing force||500 KN|
|permissible mould mass, top||3000 kg|
|permissible mould mass, bottom||4000 kg|
|fitting dimension||625 mm|