The BFT-P V10 mold carrier system has been specially developed for the user-friendly handling of mold dimensions up to a depth of 1,800 mm.

With the BFT-P V10, a shuttle moves the lower part of the mold out of the side of the carrier frame after the curing of the component has been completed. This allows the upper and lower mold halves to be operated simultaneously by two operators.

Since the system offers free access from the front and rear, feed and discharge systems for components, inserts and molds can also be integrated quickly. If required, the BFT-P V10 can also be used for fully automatic production, for example by means of a robot that inserts and removes work pieces.

Product data

Mold carrier system BFT-P V10 25x14_400kN
drive system electric
carrier clamping plate (FAP) width 2.500 mm
carrier clamping plate (FAP) depth 1.400 mm
closing force max. ≤ 400 kN
opening stroke 1.000 mm
tilting upper FAP 90°
tilting lower FAP 75 °
closing time at parallel stroke ≤ 6 s
tilting tower -
load upper FAP max. 4.000 kg
load lower FAP max. 4.000 kg

The mold carrier shown is also available in other clamping plate sizes upon request. For technical questions or purchase enquiry, please feel free to reach out to us any time.