The BFT-P V10 mold carrier system has been specially developed for the user-friendly handling of mold dimensions up to a depth of 1,800 mm.
With the BFT-P V10, a shuttle moves the lower part of the mold out of the side of the carrier frame after the curing of the component has been completed. This allows the upper and lower mold halves to be operated simultaneously by two operators.
Since the system offers free access from the front and rear, feed and discharge systems for components, inserts and molds can also be integrated quickly. If required, the BFT-P V10 can also be used for fully automatic production, for example by means of a robot that inserts and removes work pieces.
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|Mold carrier system||BFT-P V10 25x14_400kN|
|carrier clamping plate (FAP) width||2.500 mm|
|carrier clamping plate (FAP) depth||1.400 mm|
|closing force max.||≤ 400 kN|
|opening stroke||1.000 mm|
|tilting upper FAP||90°|
|tilting lower FAP||75 °|
|closing time at parallel stroke||≤ 6 s|
|load upper FAP max.||4.000 kg|
|load lower FAP max.||4.000 kg|