The high-speed BFT-P V4 mold-carrier system is the ideal candidate for any encapsulation applications that feed the foam into the open mold. The lower part of the mold is easy to place in an optimum position for a robot to feed the foam.

In addition, the BFT-P V4 stands out due to its excellent ergonomics and absolute energy efficiency. Free access at the rear and at the front facilitates the integration of feeding and withdrawal systems for inserts, components and molds.

Product data

Mold carrier system BFT-P V4 16×11
drive electric
mold mounting plate – width 1600 mm
mold mounting plate – depth 1100 mm
closing force ≤ 400 kN
parallel stroke 1300 mm
tilting angle, upper mold mounting plate 0 – 90°
tilting angle, lower mold mounting plate 0 – 40°
closing and opening times 4s
swivelling of tower ± 30°
permissible mold mass, top 1000 kg
permissible mold mass, bottom 1500 kg
fitting dimension 400 – 900 mm

The mold carrier shown is also available in other clamping plate sizes upon request. For technical questions or purchase enquiry, please feel free to reach out to us any time.