BBG Group
BFT-P V10
The BFT-P V10 mold carrier system has been specially developed for the user-friendly handling of mold dimensions up to a depth of 1800 mm.
With the BFT-P V10, a shuttle moves the lower part of the mold out of the side of the carrier frame after the curing of the component has been completed. This allows the upper and lower mold halves to be operated simultaneously by two operators.
Since the system offers free access from the front and rear, feed and discharge systems for components, inserts and molds can also be integrated quickly. If required, the BFT-P V10 can also be used for fully automatic production, for example by means of a robot that inserts and removes work pieces
Product data
| Mold carrier system | BFT-P V10 25x14_400kN |
|---|---|
| drive system | electric |
| carrier clamping plate (FAP) width | 2500 mm |
| carrier clamping plate (FAP) depth | 1400 mm |
| closing force max. | ≤ 400 kN |
| opening stroke | 1000 mm |
| tilting upper FAP | 90° |
| tilting lower FAP | 75° |
| closing time at parallel stroke | ≤ 6 s |
| tilting tower | - |
| load upper FAP max. | 4000 kg |
| load lower FAP max. | 4000 kg |
The mold carrier shown is also available in other clamping plate sizes upon request.
For technical questions or purchase enquiry, please feel free to reach out to us any time.