BBG Group
BFT-P V11
The BFT-P V11 is the latest addition to our portfolio of electrically driven mold carrier systems. It has been specially designed for the production of large, flat or slightly curved glass and composite components. Its compact design allows for easy integration into existing production lines. The system’s ergonomic concept ensures not only efficient operation but also excellent user comfort.
Another key advantage of the BFT-P V11 is its outstanding accessibility from all four sides. This enables the integration of automated loading and unloading systems for inserts and finished parts, as well as robotic solutions for part handling. Tool changing systems can also be connected without difficulty – making the system highly flexible and allowing quick adaptation to changing production requirements.
Produktdaten
| Mold carrier system | BFT-P V11 25x15_300kN |
|---|---|
| drive system | electric |
| carrier clamping plate (FAP) width | 2500 mm |
| carrier clamping plate (FAP) depth | 1500 mm |
| closing force max. | 300 kN |
| tilting upper FAP | 0-30° (90°) |
| tilting lower FAP | 0-60° |
| closing time at parallel stroke | ≤ 6 s |
| load upper FAP max. | 3500 kg |
| load lower FAP max. | 3500 kg |
| opening hight min. | 780 mm |
The mold carrier shown is also available in other clamping plate sizes upon request.
For technical questions or purchase enquiry, please feel free to reach out to us any time.