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BBG Group

BFT-P V4

The BFT-P V4 High-Speed Mold Carrier System offers ideal conditions for foaming applications where material is introduced into an open mold.

The lower mold half can be easily moved into the optimal position for foam injection using a robot. The system is characterized by outstanding ergonomics and maximum energy efficiency

Product data
Mold carrier system BFT-P V4 16×11
drive system elektrisch
mold mounting plate (FAP) width 1600 mm
mold mounting plate (FAP) depth 1100 mm
closing force max. ≤ 400 kN
parallel stroke 1300 mm
tilting angle, upper FAP 0 – 90°
tilting angle, lower FAP 0 – 40°
Closing time 4 s
tilting tower ± 30°
load max. upper FAP 1000 kg
load max. lower FAP 1500 kg
opening width min. 400 – 900 mm

The mold carrier shown is also available in other clamping plate sizes upon request.

For technical questions or purchase enquiry, please feel free to reach out to us any time.

Copyright 2025. BBG GmbH & Co. KG.
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