Shuttle Mold Carrier System

This mold carrier system has been developed specifically for LFI applications.

The shuttle, which can be moved on both sides and holds the lower tiltable mold mounting plate, supports an optimum production flow. The mold mounting plates sized 2.600 mm x 2.000 mm permit the production of large-scale LFI components for automobiles and commercial vehicles, such as engine bonnets or hoods. The mold-carrier system achieves a closing pressure of up to 2.000 kN.

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